Betterial has introduced a thermoplastic (TPO) encapsulation film designed for the low-temperature lamination needs of perovskite modules, alongside new encapsulation solutions for back-contact (BC) and TOPCon modules and a UV-conversion film for high-UV deployment environments.
The perovskite-targeted film addresses a specific degradation risk: conventional crosslinked encapsulation films can generate halide residues that chemically corrode the perovskite layer. Betterial's halogen-free TPO formulation is designed to avoid that risk while still enabling low-temperature lamination and strong adhesion between module layers. The company offers two variants for perovskite modules - the B606L high-transmittance film and the B606LP UV-cutoff film - both rated for light transmittance of at least 85% between 380 nm and 1,100 nm and adhesion to glass of at least 80 N/cm. The two differ in UV handling: B606L allows at least 75% UV transmittance, while B606LP caps UV transmittance at 10% or less, for applications where blocking UV exposure matters more than passing it through.
For BC modules, Betterial's encapsulation film uses an ultra-low-flow formulation intended to resist damp-heat aging, yellowing and potential-induced degradation (PID), while also supporting lower silver-paste consumption in the module. For TOPCon modules, the company offers a high-transmittance film aimed at improving light transmission and photon utilization, also designed to resist UV exposure and long-term aging.
Betterial also offers a light-conversion film, HC806, aimed at modules deployed in deserts, plateaus and other high-UV environments. According to the company, the film converts UV light into visible light at more than 95% efficiency, contributing a module power gain of 1.2% to 3%. Betterial reports less than 3% degradation after UV60 accelerated aging testing, and says the film helps mitigate both ultraviolet-induced degradation (UVID) and PID-related performance losses.
