BOE Technology Group has signed a three-year memorandum of understanding (MoU) with Corning Incorporated to cooperate on several next‑generation glass technologies, explicitly including perovskite glass substrates alongside glass-based packaging substrates, foldable glass and optical interconnect applications.
According to BOE’s recent disclosures, the company has been building out a multi-level perovskite development infrastructure since 2024. This includes a small glovebox R&D line, an intermediate experimental line with 300 × 300 mm substrates, and a larger pilot line with 1200 × 2400 mm glass substrates. Across these platforms, BOE reports total perovskite-related R&D investment on the order of nearly 1 billion RMB, as it explores rigid, flexible and tandem-cell architectures aimed at higher power conversion efficiency and broader application scenarios.
The new MoU suggests that Corning’s expertise in advanced glass and substrate engineering could be combined with BOE’s perovskite device and module know‑how to push perovskite glass substrates closer to scalable, production-ready formats. In principle, optimized glass substrates can improve dimensional stability, surface quality and durability for perovskite layers, while enabling larger-area modules and integration into building-integrated photovoltaics (BIPV), smart windows, and other glass-based applications.
However, BOE emphasizes that its perovskite activities are still in the technology exploration and validation phase. The company notes that perovskite glass products have not yet entered mass production, have generated no material revenue, and may not significantly affect financial results in the next few years. Likewise, the MoU with Corning is described as a framework for future project-level collaborations, with only standard clauses (such as confidentiality and IP) being legally binding at this stage.
