BOE Technology Group plans to invest more than CNY80 billion (about US$11.9 billion) in R&D and CNY800 billion (about US$119.3 billion) in procurement over the next five years as part of a broader push into what chairman Chen Yanshun called "integrated optoelectronics". The plan spans four technology areas: glass-based perovskite solar cells, glass substrates for advanced semiconductor packaging, Micro-LED optical interconnects, and foldable glass.
Glass-based perovskite photovoltaics is one of the four, alongside chip-packaging substrates aimed at AI and high-performance computing hardware, Micro-LED-based optical interconnects intended to ease bandwidth and power bottlenecks in chip-to-chip connections, and foldable glass developed with Corning. BOE said its perovskite solar cell line, already running at pilot scale, is shipping product - consistent with the company's earlier updates on accelerating that pilot line toward mass production.
Chen also said BOE has built a full-process perovskite PV R&D platform spanning lab-scale research through pilot production, and that the company has set four world records for module efficiency along the way. On the packaging side, BOE has produced and submitted large-size, high-layer-count glass substrate samples for customer evaluation, and expects to meet the conditions for a mass-production investment decision by the first half of 2027; Chen said BOE plans to define its investment approach for mass-production lines for both glass-based perovskite devices and glass-based packaging substrates within the next year.
Most of the R&D and procurement spending BOE outlined is not specific to perovskite; the bulk of the plan centers on chip-packaging glass substrates and optical interconnects, with perovskite named as one line of a larger optoelectronics strategy rather than the target of a dedicated budget. Still, the announcement is notable for tying BOE's perovskite ambitions explicitly to the company's broader semiconductor and display roadmap.