Perovskite Connect 2026 is set to be the industry's premier event, taking place on 21-22 October 2026 in Berlin, with a world-class agenda, exhibition and networking opportunities. Co-located with the Future of Electronics RESHAPED, Perovskite Connect will focus on the perovskite supply chain, solar applications, recent innovations, materials and processes.
In this article we will introduce some of our speakers and themes at the event. You can explore the full agenda and event details here.
Materials and inks: the building blocks of a manufacturable perovskite stack
As the industry pushes toward commercial-scale production, the materials inside the perovskite stack - interface layers, transport materials, inks and pastes - are just as important as the perovskite absorber itself. This year's agenda brings together several materials developers working on exactly that.
Nano-C will discuss its work engineering fullerenes and fullerene derivatives as electron transport materials for single-junction and tandem perovskite architectures, including how functionalized variants can be used to passivate interfaces and improve device stability at industrial scale.
PINA CREATION will introduce a printable indium tin oxide (ITO) nano ink designed for low-temperature fabrication of transparent conductive films, aimed at making ITO layers compatible with flexible substrates without the cost and energy demands of conventional vacuum deposition.
LinXole AB will present new Spiro-OMeTAD hole transport inks, engineered for improved moisture and thermal stability, uniform large-area printing, and reduced gold migration into the perovskite layer - all aimed at improving long-term device stability.
Germany's TU Dortmund will detail a robust, room-temperature synthesis route for tin oxide nanocrystals used in electron transport layers, designed to simplify what has traditionally been a delicate, multi-step colloidal process.
Nanografi Nanotechnology will turn to metallization, presenting a formulation strategy for high-performance silver paste - covering how silver powder, glass frit and organic binder chemistry together determine conductivity, adhesion and firing performance.
Closing the session, HB Fuller will look further downstream to module packaging, discussing the polymeric materials needed to give perovskite modules the moisture and oxygen barriers, mechanical protection and optical transparency required for field deployment.
Perovskite Connect 2026: time to reserve your seat!
These are just some of the materials and inks talks on this year's agenda, alongside sessions on comecialization, tandem cells, testing and sustainability. Perovskite Connect is co-located with the Future of Electronics RESHAPED, giving attendees full access to both conference tracks and the shared exhibition floor.