Multifunctional TiOx interconnects could promote the commercialization of perovskite/silicon tandem solar cells
Researchers at Japan's National Institute of Advanced Industrial Science and Technology (AIST) and the UK's University of Oxford have asserted that while perovskite-on-silicon tandem solar cells are highly promising, the intrinsic multilayer device design presents challenges in complexity, which can be a drawback in future mass production. To this end, they developed a TiOx layer (∼3–5 nm) grown by atomic layer deposition (ALD), that enables a series interconnection of a perovskite n-i-p top cell with a silicon wafer directly.
A photo of the tandem solar cell fabricated on a 25 mm × 25 mm Si substrate. Image from: Small
The TiOx layer serves as an all-in-one interconnect, fulfilling the functions of silicon surface passivation, hole extraction from silicon, and recombination junction at the top/bottom cell interface. As a result, a proof-of-concept 22.4%-efficient tandem device was demonstrated. Furthermore, an improved PCE of 26.5% was achieved by capping the TiOx with a thin ALD-TiNy layer (∼4 nm).